Ceramic Epoxy Dispensing Nozzle & Die Attach Nozzle for Semiconductor Packaging

Backed by around 15 years of precision machining experience in high-performance technical ceramics, LONGYI Precision Technology (Taiwan) manufactures ceramic epoxy dispensing nozzles and die attach nozzles for semiconductor packaging, LED assembly, advanced medical devices, and automated micro-dispensing. Made from high-purity alumina and zirconia, our nozzles deliver superior dimensional accuracy, micro-polished internal surfaces, and excellent wear resistance for consistent dispensing and long-term production stability.

Compared with conventional stainless-steel tooling, ceramic nozzles minimize adhesive residue, prevent glue climbing, and hold stable dispensing accuracy through continuous high-speed operation — while improving machine-to-machine matching so production programs transfer across automated lines with minimal adjustment.

Quick Answer

LONGYI ceramic dispensing and die attach nozzles use high-purity alumina and zirconia with a mold-formed, smooth slanted-hole bore — reaching inner diameters down to 0.028 mm at ±0.005 mm accuracy. Unlike drilled stainless-steel nozzles, the smoother bore prevents glue climbing and residue, needs no coating, and lasts longer, giving stable micro-dispensing for semiconductor die bonding, LED assembly, and medical electronics.

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Key Specifications

0.028 mm

Alumina Min. Inner Diameter

0.035 mm

Zirconia Min. Inner Diameter

±0.005 mm

Machining Accuracy

Alumina / Zirconia

High-Purity Ceramic Body

Product Types

Ceramic Epoxy Dispensing Nozzles

Precisely regulate adhesive flow for consistent micro-droplets and uniform dispensing. The optimized slanted-hole bore reduces flow resistance and helps prevent clogging, glue climbing, and adhesive tailing. Typical fluids: epoxy resins, micro-adhesives, solder paste, conductive silver paste, and underfill materials for semiconductor advanced packaging, LED chip assembly, and medical electronics.

Ceramic Die Attach Nozzles & Pick-up Tools

Designed for high-speed chip pick-up, vacuum handling, die bonding, and precision placement. Toughened zirconia provides excellent fracture toughness, wear resistance, and long-term dimensional stability for continuous automated die attach — eliminating the deformation common to stainless-steel tooling under continuous stress.

Applications

Epoxy & adhesive dispensing — controlled glue quantity on substrates and PCBs.
Solder paste & silver paste — conductive material dispensing.
Underfill dispensing — advanced semiconductor packaging.
Die attach / die bonding — precise chip placement.
Pick & place — vacuum handling of dies and components.
LED assembly & medical electronics — repeatable micro-dispensing.

Key Features

Ultra-fine inner diameter — down to 0.028 mm (alumina) / 0.035 mm (zirconia).
High machining precision — up to ±0.005 mm, about 6× tighter than ±0.030 mm steel tooling.
Micro-polished internal surface — reduces clogging, glue climbing, and adhesive tailing.
Mold-formed slanted-hole bore — no surface coating required.
Excellent machine-to-machine matching — seamless production-line transfer.
Press-fitted into custom holders — stainless housings matched to your equipment.
Alumina & zirconia options — material chosen to suit your process.
OEM & ODM support — from prototype through mass production.

Material Comparison for Die Bonder Applications

Epoxy dispensing and die attach nozzles are commonly made from stainless steel, alumina ceramic, or zirconia ceramic. The table summarizes typical performance based on LONGYI's manufacturing experience and semiconductor-packaging customer feedback.

Property	Stainless Steel	Alumina Ceramic	Zirconia Ceramic
Machining Accuracy	±0.030 mm	±0.005 mm	±0.005 mm
Minimum Inner Diameter	Limited	0.028 mm	0.035 mm
Internal Surface	Step hole, rough	Smooth slanted-hole	Smooth slanted-hole
Adhesive Flow	Glue climbing / residue	Stable	Smooth & stable
Wear Resistance	Moderate	High	Excellent
Dimensional Stability	May deform over time	Stable	Excellent
Service Life	Shorter	Long	Longest
Typical Applications	General dispensing	Precision dispensing	Die attach / high-volume

Stainless Steel

Cost-effective for general dispensing, but limited precision and shorter life under continuous use.

Alumina — Best Balance

Excellent balance of precision, wear resistance, and cost for precision dispensing.

Zirconia — Best Durability

Higher toughness and long-term stability, ideal for continuous die bonding and high-volume production.

Ceramic vs Metal Nozzle

Item	LONGYI Ceramic Nozzle	Conventional Stainless-Steel Nozzle
Manufacturing Method	Mold-formed ceramic	Drilled
Inner Hole Geometry	Smooth slanted-hole	Step-like
Internal Surface Finish	Fine & smooth	Rough drilled
Adhesive Flow	Smooth, stable, controlled	Glue residue / climbing likely
Surface Treatment	No coating required	Coating may be required
Dispensing Consistency	High repeatability	Moderate
Maintenance	Lower frequency	More frequent cleaning
Service Life	Longer	Shorter

This comparison is a general technical reference based on LONGYI's manufacturing experience and practical semiconductor-packaging applications. Actual performance may vary with dispensing media, equipment configuration, operating conditions, and maintenance practices.

Technical Datasheet

PDF

Epoxy Dispensing Nozzle & Die Attach Nozzle Datasheet

Inner-hole geometries, dimensional tolerances, holder configurations, material spec sheet, and ordering guide.

Download Technical Datasheet

FAQ

Common procurement and application questions from engineers and packaging teams

Do ceramic nozzles fit our existing dispensing equipment and holders?

ANSWER

Yes. LONGYI ceramic inserts can be press-fitted into custom stainless-steel holders engineered to match your existing dispensing valve, syringe, or die bonder interface, so no equipment modification is typically required. Please provide your current holder drawing or dispensing-system model for compatibility confirmation.

Can we request samples before placing a mass-production order?

ANSWER

Yes, sample nozzles can be provided for trial dispensing and process validation prior to mass production. Please confirm sample cost and lead time with our sales team.

What is the typical lead time for custom ceramic nozzles?

ANSWER

Lead time depends on inner-diameter tolerance, hole-geometry complexity, and order quantity. Please contact our sales team for standard and expedited options.

How should ceramic dispensing nozzles be cleaned and maintained?

ANSWER

Because the mold-formed ceramic bore needs no surface coating, routine cleaning is generally simpler than for drilled stainless-steel nozzles. Remove uncured adhesive promptly using solvents compatible with your dispensing media, and avoid abrasive tools that could scratch the polished inner surface.

What information do we need to provide for a custom nozzle quote?

ANSWER

Please provide the target inner diameter, dispensing fluid type and viscosity, holder or equipment interface dimensions, and required quantity. Customer drawings (PDF or DXF) can be submitted directly for engineering review.

Which industries and applications commonly use LONGYI ceramic nozzles?

ANSWER

Beyond semiconductor die bonding, LONGYI ceramic nozzles are used in LED chip assembly, microelectronics packaging, and medical device manufacturing — anywhere precise, repeatable micro-dispensing of adhesives, solder paste, or conductive materials is required.

Also Known As

Depending on the equipment maker, process, or region, this component is referred to by several names, including Epoxy Dispensing Nozzle, Die Attach Nozzle, Ceramic Dispensing Nozzle, Ceramic Capillary, Ceramic Nozzle, Micro Dispensing Nozzle, Adhesive / Glue Dispensing Nozzle, Solder Paste Nozzle, Underfill Dispensing Nozzle, Die Bonder Nozzle, and Zirconia / Alumina Ceramic Nozzle. Although the terminology varies, these names generally describe the same precision ceramic nozzle for micro-dispensing and die attach in semiconductor packaging.