The Porous Ceramic Vacuum Chuck effectively absorbs workpieces during the manufacturing process.
By collaborating with an air floating stage and a non-contact transfer system, the Vacuum Chuck can elevate workpieces.
pRINCIPLE
When the ceramic emits airflow outward (negative vacuum pressure), it secures the workpieces through absorption.
Conversely, when the ceramic receives inward airflow (positive vacuum pressure), it either lifts the workpieces or keeps them from making direct contact with the ceramic surface.
Vacuum nozzle, pick and place workpiece
Bonding stage, soft material bonding
Air bearing, low friction rails
Touchless glass transfer stage
Testing AOI system
applications in semicon industry
Wafer Transportation
Wafer Dicing
Laser Dicing
Wafer Grind
Wafer Cleaning
features
Secure parts that’s complex (warped, hollowed, various sizing)
Tiny pore sizes (2um) makes the surface contact traceless.
Great mechanical strength
Heat Resistance
Chemical resistance
Static dissipative (More)
usage requirements
High precision flatness
Great Permeable
Reliable adhesive
Flat joint
Massive air flow
Large bore pipes and fittings
Item No. / SPEC.(mm) |
L |
W |
T |
Flatness (um) |
C-PRO-GB-10-10 |
100 |
100 |
29 |
0.01 |
C-PRO-GB-20-20 |
200 |
200 |
29 |
0.01 |
C-PRO-GB-30-25 |
300 |
250 |
29 |
0.02 |
C-PRO-GB-40-30 |
400 |
300 |
32 |
0.02 |
C-PRO-GB-60-30 |
600 |
300 |
35 |
0.03 |
C-PRO-GB-120-80 |
1200 |
800 |
60 |
0.05 |
C-PRO-GB-100-100 |
1000 |
1000 |
60 |
0.05 |
Item No. / SPEC.(mm) | L | W | T | Net/Weight(cm) |
CPC-SS-06 | 6 | 0.005 | 1.7 | 33X33X6 |
CPC-SS-08 | 8 | 0.005 | 3 | 33X33X6 |
CPC-SS-12 | 12 | 0.008 | 9.3 | 45X45X6 |