POROUS CERAMIC Vacuum Chuck

POROUS CERAMIC VACUUM CHUCK Ideal for securing delicate materials in semiconductor manufacturing processes, our vacuum chucks ensure optimal grip and minimal surface distortion.

Porous ceramic KEY CHARACTERISTIC

The Porous Ceramic Vacuum Chuck effectively absorbs workpieces during the manufacturing process. 

By collaborating with an air floating stage and a non-contact transfer system, the Vacuum Chuck can elevate workpieces.

pRINCIPLE

When the ceramic emits airflow outward (negative vacuum pressure), it secures the workpieces through absorption.

Conversely, when the ceramic receives inward airflow (positive vacuum pressure), it either lifts the workpieces or keeps them from making direct contact with the ceramic surface.

Vacuum nozzle, pick and place workpiece

Bonding stage, soft material bonding

Air bearing, low friction rails

Touchless glass transfer stage 

Testing AOI system

 
 

applications in semicon industry

Wafer Transportation
Wafer Dicing
Laser Dicing
Wafer Grind
Wafer Cleaning

features

Secure parts that’s complex (warped, hollowed, various sizing)
Tiny pore sizes (2um) makes the surface contact traceless.
Great mechanical strength
Heat Resistance
Chemical resistance
Static dissipative

usage requirements

High precision flatness
Great Permeable
Reliable adhesive
Flat joint
Massive air flow
Large bore pipes and fittings

Item No. / SPEC.(mm)

L

W

T

Flatness (um)

C-PRO-GB-10-10

100

100

29

0.01

C-PRO-GB-20-20

200

200

29

0.01

C-PRO-GB-30-25

300

250

29

0.02

C-PRO-GB-40-30

400

300

32

0.02

C-PRO-GB-60-30

600

300

35

0.03

C-PRO-GB-120-80

1200

800

60

0.05

C-PRO-GB-100-100

1000

1000

60

0.05

Item No. / SPEC.(mm)LWTNet/Weight(cm)
CPC-SS-0660.0051.733X33X6
CPC-SS-0880.005333X33X6
CPC-SS-12120.0089.345X45X6
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