taiwan SemiConductor Process equipment ceramic parts

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Advanced ceramic used in semiconductor PROCESS equipment

The use of advanced ceramics in Taiwan semiconductor process equipment ceramic parts helps enhance the performance, reliability, and longevity of critical components in the semiconductor manufacturing process. These ceramics contribute to the industry’s ability to produce smaller, faster, and more efficient electronic devices. more

Advantages of advanced Ceramic

  1. Thermal Stability: Advanced ceramics possess high thermal stability, allowing them to withstand extreme temperatures encountered in semiconductor manufacturing processes. This property is essential in environments where temperature control is critical for precise and consistent outcomes.

  2. Chemical Resistance: Semiconductor processes involve exposure to various chemicals. Advanced ceramics are known for their excellent chemical resistance, protecting equipment from corrosive substances and ensuring a longer operational life.

  3. Mechanical Strength and Hardness: The mechanical strength and hardness of advanced ceramics make them suitable for components subjected to wear and stress. This is vital in semiconductor equipment where parts often undergo mechanical stress during operation.

  4. Dielectric Properties: Advanced ceramics exhibit exceptional dielectric properties, making them ideal for insulating components in semiconductor devices. This is crucial for preventing electrical interference and maintaining the integrity of electronic circuits.

  5. Dimensional Stability: Precision is paramount in semiconductor manufacturing. Advanced ceramics offer excellent dimensional stability, ensuring that components maintain their shape and size under varying conditions, contributing to the overall accuracy of the equipment.

  6. Low Friction Coefficient: The low friction coefficient of advanced ceramics reduces wear and tear in moving parts of semiconductor equipment. This property enhances the durability and reliability of the machinery.

  7. High Purity Levels: Ceramics used in semiconductor processes are often manufactured with high levels of purity. This is essential to prevent contamination of the semiconductor materials and maintain the integrity of the manufacturing environment.

  8. Customizability: Advanced ceramics can be engineered to meet specific requirements, allowing for the customization of components based on the unique needs of semiconductor processes. This versatility enhances their applicability in diverse applications within the industry.

Electrostatic Dissipation Effect (ESD MATERIAL) IN SEMICONDUCTOR

Microporous ceramics, made from top-notch materials like aluminum oxide and silicon carbide, exhibit remarkable properties like high temperature resistance and controllable pore structures. With applications ranging from precision filtration to gas noise reduction, these ceramics can also incorporate carbon components for electrostatic dissipation. Their versatility extends to innovative products like vacuum suction cups and air bearings when combined with other materials which’s very useful in Taiwan semiconductor process equipment ceramic parts.

Electrostatic discharge (ESD) is a primary factor causing most electronic component or system failures and damages. ESD is often generated due to human factors and is difficult to avoid. Electrostatic dissipation has become a crucial concern in the semiconductor and optoelectronic industries. To address this demand, LONGYI has improved the performance of microporous ceramics.

Porous ceramics and catalyst carriers Porous ceramics serve as excellent active and highly absorbent materials. The reaction rate and conversion efficiency of the fluid passing through the porous ceramic network are significantly enhanced. Ceramic catalyst carriers play a crucial role in promoting chemical reactions. Due to the chemical corrosion resistance and thermal shock resistance of porous ceramics, they can be used in demanding conditions such as reactors in chemical engineering and automotive exhaust treatment. Moreover, fine metal particles are typically loaded onto heterogeneous catalyst carriers, often made of ceramics. Thus making this material crucial in semiconductor process equipment ceramic parts