Heat Bond plate

Heat Bond Head：圖片 2

Heat Bond Head：圖片 3

Heat Bond Head：圖片 4

Heat Bond Head：圖片 5

Heat Bond Head：圖片 6

Heat Bond Head：圖片 7

Heat Bond Head：圖片 8

Heat Bond Head：圖片 9

Heat Bond Head

Material: Aluminum Nitride

Thermal Conductivity: Up to 220 W/mK

Surface Roughness: Ra0.1

Customization: Available upon request

分類: Heat Bond Head

描述

Heat Bond Head

Heat Bond Head is used during the die bonding process, it dispenses high temperature adhesive substances. As it needs to withstand extreme temperatures, thus we made it from aluminium nitride (AlN).

Item No. A A1 B B1 C

CC-P760B 17.6 17.6 1.4 10.0 3.2

CC-P761C 17.6 17.6 2.8 8.6 3.2

E01 22.0 22.0 3.5 9.0 4.0

E02 22.0 22.0 3.2 9.0 4.0

I60B 22.0 22.0 4.0 14.0 4.0

I60B-A 22.0 22.0 4.0 16.0 4.0