Die Bonding Tools

Material: Zirconium oxide (ZrO2)

Tolerance requirements:0.01mm

Application:  Die bonding

Industries: LED/Semiconductor

Equipment manufacturer:ASM/NEC

Die Bonding Tools

Die Bonding Tools are used in the back-end process of bonding.

Its functions include protecting substrate, microcircuit, IC

And preventing the possible damages from dust, moisture, light and other substances that might cause the damages of products.
Die Bonding Tools can do a variety of other functions depending on what specific needs the business requires.

Custom design at your request

Die Bonding Tools

Die Bonding Tools can be applied in many places.

If you need to know the processing details of other related Die Bonding Tools

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