Die Bonding Stamping Pin

Material: Zirconium oxide (ZrO2)

Tolerance requirements:0.01mm

Application:  Die bonding

Industries: LED/Semiconductor

Equipment manufacturer:ASM/NEC

Die Bonding Stamping Pin is used in the back-end process of bonding. Its functions include protecting substrate, microcircuit, IC, and preventing the possible damages from dust, moisture, light and other substances that might cause the damages of products. Can do a variety of other functions depending on what specific needs the business requires.

High speed epoxy “dotting”. Widely used in industries such as IC sealing, photovoltaic, LCD, LED sealing, LED potting, computer/phone cases and frames adhesion, SMT parts, circuit board assembly etc.

Custom design at your request