Heat Bond plate
Heat Bond Head - Image 2
Heat Bond Head - Image 3
Heat Bond Head - Image 4
Heat Bond Head - Image 5
Heat Bond Head - Image 6
Heat Bond Head - Image 7
Heat Bond Head - Image 8
Heat Bond Head - Image 9

Heat Bond Head

Material: Aluminum Nitride

Thermal Conductivity: Up to 220 W/mK

Surface Roughness: Ra0.1

Customization: Available upon request

Category:

Heat Bond Head

Heat Bond Head is used during the die bonding process, it dispenses high temperature adhesive substances. As it needs to withstand extreme temperatures, thus we made it from aluminium nitride (AlN).

Item No.            A       A1       B      B1    C

CC-P760B   17.6     17.6     1.4 10.0   3.2

CC-P761C   17.6     17.6     2.8   8.6  3.2

E01             22.0     22.0     3.5   9.0  4.0

E02         22.0     22.0   3.2 9.0  4.0

I60B         22.0    22.0     4.0 14.0   4.0

I60B-A       22.0    22.0     4.0 16.0   4.0

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