Why made it?
This is a new application, mainly to overcome the problems of optical lens film and semiconductor process chip bonding, including:
- Chip deformation.
- Chip traces.
- The thickness of the glue.
The above problems are not only the technology industry wants to overcome, but also the most important issue of LCD.
Flip Chip Die Attach Nozzle Composition
Stainless steel is used as a holder, and a large amount of airflow is used to enter the microporous ceramic to achieve adsorption. Flip chip
| Material: | Al2O3 92% | Water%: | 0% |
| Porosity: | 35~40% | Pore size: | 2~3um |
| Bending: | >6kgf/cm2 | Bulk Specific: | 2.28 g/cm3 |
