Aluminum Nitride (AlN)
A new low temperature process for the production of Aluminum Nitride (AlN) ultrafine powders involves the reaction of acetal aluminum and anhydrous hydrazine at 80 ° C in acetonitrile. The amorphous precursor is then heated in nitrogen, argon or ammonia to form a crystalline product <1000 °C.
Aluminum nitride has higher thermal conductivity. The inertia is extremely stable under high-temperature environment. In the air, the substance’s surface will become oxidation when the temperature is higher than 700℃. At normal temperature, the substance’s surface still has 5 to 10 nano oxidation membranes.
Spec items: 99% white
Physical Properties
Specific gravity: 3.2 g/m3
Porosity: 0 %
Mechanical Properties
Hardness: 11.2 HV
Flexural strength: 220 Mpa
Compressive strength: 2070 Mpa
Young’s modulus: 310 Pa (N/m^2)
Fracture toughness: –
Thermal Properties
Coefficient of thermal expansion: 4.6 40~400°C X10-6/°C , 5.240~800°C X10-6/°C
Thermal conductivity: 67 W/m-k
Specific heat: 730 (J/kg*°K)
Thermal shock/Resistor (put in water): –
Electrical Properties
Dielectric strength : 16KV/mm
Volume resistivity : >101420°C/Ω.cm
109500°C/Ω.cm
Permittivity : 8.5 (1MHz) C2/ (N．M2)
Dielectric loss angle: 2 (1MHz) (X10-4)